About WayTronX

ONSCREEN RECEIVES U.S. PATENT FOR ITS WAYCOOL™ TECHNOLOGY


PORTLAND, OR – (BUSINESS WIRE) – July 1, 2007 – OnScreen™ Technologies, Inc. (OTCBB:ONSC), a leader in providing leading-edge thermal management technology solutions, today announced that it has received a full grant of United States Letters Patent from the U.S. Patent and Trademark Office covering the Company’s proprietary WayCool™ thermal management technology.  The technology represents a major breakthrough in thermal management capabilities that increases performance and reliability while decreasing energy use in high-end electronic components.

The Letters Patent, from an application entitled "Cooling Systems Incorporating Heat Transfer Meshes,” represents full patent coverage and associated protections of OnScreen’s WayCool-related intellectual property, providing for the use of meshes for cooling in a broad spectrum of applications.  Unique design elements, including the use of meshes, and resulting functionality underlying the novel WayCool thermal cooling capabilities, have been proven to enable the efficient transfer of heat at extraordinarily high rates, thus promoting superior thermal management in high end electronic components.

William Clough, EVP of OnScreen Corporate Development, explains, “The issuance of this patent is a significant milestone in advancing our openly licensable thermal management IP company.  OnScreen is designing the heat control technology that will lie at the heart of most advanced digital products.”  Clough continued that, “We are working closely to apply this technology in strategic applications with customers and partners such as OCZ Technology Group (LSE: OCZ) and ThermalTake Technology Co., Ltd, while engaging in new collaborative licensing and royalty opportunities with companies seeking viable thermal cooling solutions across a variety of markets.”

Company CTO, Dr. Michael Schuette, commented that, "The issuance of this patent by the USPTO protects key elements of this breakthrough technology.  We fully expect mesh-based heat transfer units to revolutionize the cooling process in electronics because of their higher efficiency and lower total cost of ownership compared with other cooling solutions currently available.”

About OnScreen Technologies, Inc.

Headquartered in Portland, Oregon, OnScreen Technologies, Inc. has pioneered and is commercializing innovative thermal management solutions capable of revolutionizing the semiconductor, solar and electronic packaging industries, among others.  Utilizing its patented thermal technologies and architecture, OnScreen has developed highly advanced, proprietary central and graphics processor solutions; solar energy cooling solutions; and power supply cooling solutions, delivering more cost effective and efficient thermal management to the industry than other  solutions.  For more information, please visit www.onscreentech.com

Safe Harbor Statement

This document contains forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended.  Such statements are subject to risks and uncertainties that could cause actual results to vary materially from those projected in the forward-looking statements.  The company may experience significant fluctuations in future operating results due to a number of economic, competitive, and other factors, including, among other things, our reliance on third-party manufacturers and suppliers, government agency budgetary and political constraints, new or increased competition, changes in market demand, and the performance or reliability of our products.  These factors and others could cause operating results to vary significantly from those in prior periods, and those projected in forward-looking statements.  Additional information with respect to these and other factors, which could materially affect the company and its operations, are included in certain forms the company has filed with the Securities and Exchange Commission.