Solving Density Issues

Waytronx™ WayCool™ architecture has been designed specifically to address the extreme power density and cooling requirements of high performance chipsets.  WayCool Carbon technology conductively removes heat at rates up to four times that of typical copper plate heat conductors.  WayCool™ Mesh, WayCoolant™ Liquid Coolant, and WayCool™ Pumps work with traditional fan cooling to provide a hybrid (liquid + air) cooling architecture of unprecedented convenience and cooling capability, enabling integrated CPU/chipset cooling.  

WayCool Hybrid Mesh offers a roadmap incorporating WayFast™ I/O capabilities as well as a power delivery fabric that will enable massively parallel chipset i/o in future 3D packaging.

Integrated Solution

The WayCool U400NT Integrated Reference Design for CPU + Chipset + Graphics systems

• Provides up to 400 Watts of thermal capacity
• Replaces multiple liquid or air chipset coolers in desktop and workstation PCs
• Integrates CPU and Chipset and/or graphics thermal management into one cooling system

If you're a chip designer seeking better thermal management solutions, call our development team at (866) WAYTRNX or contact us at engineering@waytronx.com.