Advanced Graphics Need Waytronx

Waytronx™ WayCool™ architecture has been designed specifically to address the extreme power density and cooling requirements of today's advanced high performance graphics chips. 

The WayCool U350GX Graphics Reference Design includes WayCool Carbon technology that that conductively removes heat at rates up to 4x that of typical copper plate heat conductors.  WayCool™ Mesh and WayCoolant™ liquid coolant provide a hybrid (liquid + air) cooling architecture of unprecedented thermal management capability and convenience. 

Future graphics processor designs are now incorporating "MIPs per WATT" design goals in addition to traditional performance attributes.  This shows the increasing attention to power consumption and power dissipation in the designing of modern processors.   WayCool Hybrid Mesh offers a roadmap incorporating WayFast™ I/O technology capabilities as well as a power delivery fabric that will enable future 3D packaging at even higher power densities.

If you're an advanced GFX designer in need of cooler, faster and more cost effective solutions, contact our development team at (866) WAYTRNX or write to us at engineering@waytronx.com.