The Problem with Notebooks

Notebook computers are typically made to rest on a solid surface. Unfortunately, a flat surface is the least desirable angle to dissipate heat; lower temperatures are achieved by a chimney effect when a laptop is set at an angle from horizontal. This is why notebooks should not be used on surfaces which impede the free flow of air, as it could cause severe heat damage.

Several solutions are available to help the heat issue in laptops including the use of laptop stands and energy saving techniques provided by groups such as Climate Savers Computing Initiative and the U.S Government's Energy Star 4.0 Computer specification.

WayCool Optimized for Notebook Computers

However, this is not nearly enough to resolve the issue of laptop heating. Waytronx™ WayCool™ Architecture has been designed specifically to address the extreme power density and cooling requirements of notebook computers.  WayCool Carbon technology conductively removes heat at rates up to four times that of typical copper plate heat conductors. 

WayCool™ Mesh, WayCoolant™ Liquid Coolant, and WayCool™ hermetically sealed Pumps combine with traditional fan cooling to provide a hybrid liquid-air cooling architecture of unprecedented convenience and cooling capability.

Thanks to WayCool Hybrid Mesh, integrated notebook computer cooling of batteries, CPUs, chipsets, memory and graphics in a flexible form factor is now possible. Waytronx offers a roadmap incorporating WayFast™ i/o capabilities as well as a power delivery fabric that will enable massively parallel chipset i/o in future 3D packaging.

If you're a system developer focused on notebook design, ask our development team about the WayCool solutions tailored for you at (866) WAYTRNX or write to us at engineering@waytronx.com.