Be Cool. Be Fast. The Waytronx Way.

At Waytronx, we think in multi-dimensions. Three, to be exact. That's three for 3D packaging. And we have three solutions for 3D packaging. We call them the 3C's:

• Cooling
• Communications
• Current

3C for 3D -- that's our mantra. That's the Waytronx Way.

To be fast, you need WayFast™

Waytronx™ WayFast™ 3D packaging technology includes layers of woven meshes in direct contact with semiconductor chip surfaces.  The meshes may be made with electrical power delivery and/or wire line communications in one or two axis options and an optional short distance parallel optical fiber communications in the opposite axis.  This allows high speed power management and data communications at enormously increased rates.

WayFast™ Hybrid Mesh Architecture

Just like WayCool technology offers a hybrid (air + liquid) approach for enhanced cooling, WayFast technology is also hybrid in nature. Bringing electrical i/o + optical i/o solutions together into a single, integrated system expands design opportunities and enhances performance in any application.

• WayFast Electrical I/O  3D packaging schemes typically require offsets for wire bonding and multilayered circuit boards at the top and/or bottom of the stack to provide i/o connectivity. WayCool Hybrid Mesh interposers provide i/o opportunities at each layer.
• WayFast Optical I/O  As silicon lasers, VCSELs and parallel optical buses continue to improve and evolve, WayFast Communications provides a convenient integration path for optical communications. WayCool Hybrid Mesh provides a convenient upgrade path to transition from electrical to optical i/o or even combine the two types of i/o in 3D packaging.

Multiple die stack with alternating optical conduit arrays and electrical conduit

To learn more about WayFast communications technology, contact our development team at (866) WAYTRNX or send an email to engineering@waytronx.com.